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LT8584IFE#PBF - Analog Devices

Description: LINEAR TECHNOLOGY - LT8584IFE#PBF - IC, MONOLITHIC CELL BALANCER, TSSOP-16

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LT8584IFE#PBF - Analog Devices - PCB symbol
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PCB Footprints
LT8584IFE#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - FE Package 16-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663) Exposed Pad Variation BC
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3D Models
LT8584IFE#PBF - Analog Devices - 3D model - Small Outline Packages - FE Package 16-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663) Exposed Pad Variation BC
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LT8584IFE#PBF Details

  • Manufacturer Part Number:

    LT8584IFE#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1663 (BC)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    BATTERY PROTECTOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.3 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    4.2 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LT8584IFE#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT8584IFE involves keeping the input and output capacitors close to the IC, using a solid ground plane, and separating the analog and digital grounds. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the output capacitor has a low ESR and is properly decoupled from the output voltage. Also, avoid using capacitors with high ESL and ESR values.
  • The LT8584IFE can handle input voltages up to 42V, but it's recommended to keep the input voltage below 36V for optimal performance and reliability.
  • The LT8584IFE is rated for operation up to 125°C, but it's recommended to derate the output current and input voltage at high temperatures to ensure reliability. Additionally, ensure good thermal design and heat sinking to prevent overheating.
  • To troubleshoot issues with the LT8584IFE, start by checking the input voltage, output voltage, and output current. Verify that the component values and PCB layout meet the recommended guidelines. Use an oscilloscope to check for oscillations or noise on the output voltage. Also, check for thermal issues by measuring the junction temperature and ensuring good heat sinking.

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LT8584IFE#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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