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LT8609BEMSE#TRPBF - Analog Devices

Description: Switching Voltage Regulators 42V, 2A Synchronous Step-Down Regulator with 2.5A Quiescent Current

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LT8609BEMSE#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSE Package 10-Lead Plastic MSOP
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LT8609BEMSE#TRPBF - Analog Devices  - 3D model - Small Outline Packages - MSE Package 10-Lead Plastic MSOP
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LT8609BEMSE#TRPBF Details

  • Manufacturer Part Number:

    LT8609BEMSE#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    05-08-1664

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    42 V

  • Input Voltage-Min:

    3 V

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Output Voltage-Max:

    42 V

  • Output Voltage-Min:

    0.782 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2175 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LT8609BEMSE#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT8609 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce EMI and noise. A 4-layer board with a dedicated power plane and a separate ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and layout guidelines in the datasheet. Additionally, use a low-ESR output capacitor, and add a small ceramic capacitor (e.g., 10nF) between the VIN and EN pins to filter out noise. Also, avoid using long, thin traces and minimize the distance between the input and output capacitors.
  • The LT8609 is rated for operation from -40°C to 125°C, but the maximum ambient temperature range depends on the specific application and the device's power dissipation. For most applications, the maximum ambient temperature is around 85°C to 90°C, but this can be derated based on the device's power dissipation and the thermal resistance of the PCB and surrounding environment.
  • Yes, the LT8609 is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard for automotive applications and is also suitable for industrial and medical applications that require high reliability. However, it's essential to follow the recommended design and layout guidelines, and to perform thorough testing and validation to ensure the device meets the specific application requirements.
  • The power dissipation of the LT8609 can be calculated using the following formula: Pd = (VIN x IIN) + (VOUT x IOUT) + (VIN x IQ), where IQ is the quiescent current. The maximum power dissipation is typically around 2.5W, but this can vary depending on the specific application and operating conditions. It's essential to ensure the device is properly heatsinked and that the PCB is designed to dissipate heat effectively.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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