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LTC1257IS8#PBF - Analog Devices

Description: Linear Technology LTC1257IS8#PBF, 12 bit Serial DAC, 8-Pin SOIC

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LTC1257IS8#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTC1257IS8#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - S8 Package 8-Lead Plastic Small Outline (Narrow .150 Inch) (Reference LTC DWG # 05-08-1610)
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3D Models
LTC1257IS8#PBF - Analog Devices - 3D model - Small Outline Packages - S8 Package 8-Lead Plastic Small Outline (Narrow .150 Inch) (Reference LTC DWG # 05-08-1610)
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LTC1257IS8#PBF Details

  • Manufacturer Part Number:

    LTC1257IS8#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.150 INCH, LEAD FREE, PLASTIC, SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1610 (S8)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog Output Voltage-Max:

    12 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9025 mm

  • Linearity Error-Max (EL):

    0.0977%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.752 mm

  • Settling Time-Nom (tstl):

    6 µs

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

LTC1257IS8#PBF Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the LTC1257IS8 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing the device close to the power supply bypass capacitors. A 4-layer PCB with a dedicated ground plane is recommended.
  • To optimize the performance of the LTC1257IS8, ensure that the input and output capacitors are of high quality and have low ESR, use a low impedance power supply, and minimize the distance between the device and the power supply bypass capacitors. Additionally, use a low noise, low impedance clock source and ensure that the device is operated within its recommended operating conditions.
  • The LTC1257IS8 has a maximum junction temperature of 150°C. To ensure reliable operation, the device should be operated at a junction temperature below 125°C. A thermal pad is available on the package to help dissipate heat. A heat sink or thermal interface material can be used to further reduce the junction temperature.
  • To troubleshoot issues with the LTC1257IS8, start by verifying that the device is properly powered and that the input and output voltages are within the recommended operating range. Check for noise and ripple on the power supply lines and ensure that the device is operated within its recommended operating conditions. Use an oscilloscope to verify the output waveform and check for signs of oscillation or instability.
  • The LTC1257IS8 is a high-frequency device and can be susceptible to electromagnetic interference (EMI) and radio-frequency interference (RFI). To minimize EMI and RFI, use a shielded enclosure, keep the device away from antennas and other sources of radiation, and use EMI filters or shielding on the input and output lines.

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LTC1257IS8#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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