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LTC1380CGN#PBF - Analog Devices

Description: Multiplexer Switch ICs 1x-Ended 8-Ch/ Diff 4-Ch Analog Multxer

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LTC1380CGN#PBF - Analog Devices - PCB symbol
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LTC1380CGN#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - GN Package 16-Lead Plastic SSOP
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LTC1380CGN#PBF - Analog Devices - 3D model - Small Outline Packages - GN Package 16-Lead Plastic SSOP
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LTC1380CGN#PBF Details

  • Manufacturer Part Number:

    LTC1380CGN#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.150 INCH, PLASTIC, SSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1641 (GN16)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Max (Vsup):

    -5 V

  • Neg Supply Voltage-Min (Vsup):

    -2.7 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Normal Position:

    NO

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    65 dB

  • On-state Resistance Match-Nom:

    24 Ω

  • On-state Resistance-Max (Ron):

    120 Ω

  • Operating Temperature-Max:

    70 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    0.02 mA

  • Supply Voltage-Max (Vsup):

    5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    1200 ns

  • Switch-on Time-Max:

    1500 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

LTC1380CGN#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC1380CGN#PBF involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a low-ESR capacitor for the VCC pin and to keep the input and output traces short and away from noise sources.
  • To ensure proper power-up and initialization, make sure to follow the recommended power-up sequence, which is to apply VCC before applying any input signals. Also, ensure that the VCC pin is bypassed with a suitable capacitor and that the device is operated within the recommended operating temperature range.
  • The maximum allowable input voltage for the LTC1380CGN#PBF is 5.5V. To protect the device from overvoltage, use a voltage limiter or a clamp circuit at the input, and ensure that the input voltage does not exceed the maximum rating. Additionally, consider using a TVS diode or a zener diode to absorb any voltage transients.
  • To optimize the performance of the LTC1380CGN#PBF in a high-frequency application, use a low-ESR capacitor for the VCC pin, minimize the input and output trace lengths, and use a good quality PCB material with low dielectric loss. Additionally, consider using a shielded enclosure and a common-mode choke to reduce electromagnetic interference.
  • The recommended method for thermal management of the LTC1380CGN#PBF is to use a heat sink or a thermal pad to dissipate heat away from the device. Ensure that the heat sink or thermal pad is properly attached to the device and that the thermal interface material is of good quality. Additionally, consider using a thermally conductive PCB material and a good airflow around the device to reduce thermal resistance.

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LTC1380CGN#PBF Overview

Use the download button to access the LTC1380CGN#PBF schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LTC13, or try a keyword search, such as Multiplexers or Switches

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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