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LTC1403ACMSE-1#PBF - Analog Devices

Description: Analog to Digital Converters - ADC Serial 14-B, 2.8Msps Smpl ADCs w/ SD

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LTC1403ACMSE-1#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSE Package 10-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1664 Rev I)
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LTC1403ACMSE-1#PBF - Analog Devices  - 3D model - Small Outline Packages - MSE Package 10-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1664 Rev I)
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LTC1403ACMSE-1#PBF Details

  • Manufacturer Part Number:

    LTC1403ACMSE-1#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    05-08-1664

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    1.25 V

  • Analog Input Voltage-Min:

    -1.25 V

  • Conversion Time-Max:

    357 µs

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    1

  • Number of Bits:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    70 °C

  • Output Bit Code:

    BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    2.8 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    7 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC1403ACMSE-1#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC1403 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the analog signal traces. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • The LTC1403 requires a clean and stable power supply. Use a high-quality voltage regulator, and decouple the power pins with a 10uF ceramic capacitor and a 100nF ceramic capacitor in parallel. Place the decoupling capacitors as close to the power pins as possible.
  • The maximum clock frequency for the LTC1403 is 50MHz. However, the actual clock frequency used may be limited by the specific application and the quality of the clock signal.
  • The digital output data from the LTC1403 is in a 12-bit, two's complement format. The data can be processed using a microcontroller or an FPGA. Ensure that the receiving device can handle the data rate and format of the LTC1403.
  • The typical power consumption of the LTC1403 is around 150mW at a supply voltage of 5V and a clock frequency of 20MHz. However, the actual power consumption may vary depending on the specific application and operating conditions.

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LTC1403ACMSE-1#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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