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LTC1412IG#PBF - Analog Devices

Description: Analog to Digital Converters - ADC 12-Bit 3Msps Sampling ADC

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LTC1412IG#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - G Package 28-Lead Plastic SSOP (0.209) (LTC DWG # 05-08-1640)
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LTC1412IG#PBF - Analog Devices  - 3D model - Small Outline Packages - G Package 28-Lead Plastic SSOP (0.209) (LTC DWG # 05-08-1640)
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LTC1412IG#PBF Details

  • Manufacturer Part Number:

    LTC1412IG#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    05-08-1640 (G28)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog Input Voltage-Max:

    2.5 V

  • Analog Input Voltage-Min:

    -2.5 V

  • Conversion Time-Max:

    0.283 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    10.2 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Negative Supply Voltage-Nom:

    -5 V

  • Number of Analog In Channels:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    PARALLEL, WORD

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    3 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    2 mm

  • Supply Current-Max:

    16 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.3 mm

LTC1412IG#PBF Frequently Asked Questions (FAQs)

  • A good layout and routing practice for the LTC1412IG#PBF involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the input traces. Additionally, it's recommended to use a low-ESR capacitor for the VCC bypass and to keep the analog and digital signals separate to minimize noise coupling.
  • To ensure the LTC1412IG#PBF operates within its specified temperature range, it's essential to provide adequate heat sinking and thermal management. This can be achieved by using a heat sink, ensuring good airflow, and keeping the device away from other heat sources. It's also crucial to monitor the device's temperature and adjust the system design accordingly.
  • Potential sources of error in the LTC1412IG#PBF include offset voltage, gain error, and nonlinearity. These errors can be minimized by using a high-precision voltage reference, ensuring proper PCB layout and routing, and calibrating the device during production. Additionally, using a high-quality external clock source and minimizing noise coupling can also help reduce errors.
  • To troubleshoot issues with the LTC1412IG#PBF, start by verifying the power supply voltage, checking for proper PCB layout and routing, and ensuring the device is operated within its specified temperature range. Use an oscilloscope to monitor the output voltage and clock signals, and check for any signs of oscillation or noise. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • The LTC1412IG#PBF, like any other electronic device, can be susceptible to radiation and EMI. To mitigate these effects, use shielding, filtering, and grounding techniques to minimize the impact of EMI. Additionally, consider using radiation-hardened components and designing the system with radiation tolerance in mind.

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LTC1412IG#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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