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LTC1453CN8#PBF - Analog Devices

Description: LTC1453CN8#PBF, 12 bit-Bit DAC SPI, 8-Pin PDIP

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LTC1453CN8#PBF - Analog Devices PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - N8 8-Lead PDIP
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LTC1453CN8#PBF - Analog Devices  - 3D model - Dual-In-Line Packages - N8 8-Lead PDIP
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LTC1453CN8#PBF Details

  • Manufacturer Part Number:

    LTC1453CN8#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.300 INCH, PLASTIC, DIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1510 (N8)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog Output Voltage-Max:

    2.54 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Linearity Error-Max (EL):

    0.0977%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.937 mm

  • Settling Time-Nom (tstl):

    14 µs

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.62 mm

LTC1453CN8#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC1453CN8#PBF involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing noise coupling between the analog and digital sections. A 4-layer PCB with a dedicated analog ground plane is recommended. Additionally, keep the input and output traces short and away from each other to minimize noise and crosstalk.
  • To ensure proper powering and decoupling of the LTC1453CN8#PBF, use a high-quality, low-ESR capacitor (e.g., 10uF ceramic) between the VCC and GND pins, and a smaller capacitor (e.g., 100nF ceramic) between the VCC and AVCC pins. Additionally, use a separate analog power supply or a well-regulated digital power supply to minimize noise and ripple.
  • The maximum clock frequency that can be used with the LTC1453CN8#PBF is 4MHz. However, the actual clock frequency may be limited by the specific application and the quality of the clock signal. It's recommended to consult the datasheet and application notes for more information on clock frequency limitations.
  • The LTC1453CN8#PBF outputs data in a 12-bit, two's complement format. To handle this output data, you can use a microcontroller or FPGA to read the data and convert it to a more usable format, such as a 16-bit or 32-bit signed integer. You can also use a dedicated ADC interface IC to simplify the data conversion process.
  • The typical conversion time of the LTC1453CN8#PBF is 1.5us per channel, but this can vary depending on the specific application and the clock frequency used. It's recommended to consult the datasheet and application notes for more information on conversion time and throughput.

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LTC1453CN8#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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