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LTC1609IG#PBF - Analog Devices

Description: Analog to Digital Converters - ADC Serial 16-Bit, 200ksps ADC

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LTC1609IG#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 28-Lead Plastic SSOP (5.3mm)
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LTC1609IG#PBF - Analog Devices  - 3D model - Small Outline Packages - 28-Lead Plastic SSOP (5.3mm)
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LTC1609IG#PBF Details

  • Manufacturer Part Number:

    LTC1609IG#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    05-08-1640 (G28)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog Input Voltage-Max:

    10 V

  • Analog Input Voltage-Min:

    -10 V

  • Conversion Time-Max:

    3 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    10.2 mm

  • Linearity Error-Max (EL):

    0.0046%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    3

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.2 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    2 mm

  • Supply Current-Max:

    2 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.3 mm

LTC1609IG#PBF Frequently Asked Questions (FAQs)

  • A good layout and routing practice is to keep the analog and digital grounds separate, use a solid ground plane, and keep the signal traces short and away from noise sources. Additionally, use a low-ESR capacitor for the VCC pin and a 0.1uF capacitor for the AVCC pin.
  • The LTC1609IG#PBF requires a single 3.3V or 5V power supply. Ensure that the power supply is clean and well-regulated. Power sequencing is not critical, but it's recommended to power up the analog supply (AVCC) before the digital supply (VCC).
  • The maximum data rate of the LTC1609IG#PBF is 100Mbps. The limitation is mainly due to the internal clock frequency and the settling time of the analog-to-digital converter. To achieve the maximum data rate, ensure that the input signal is properly filtered and the clock frequency is set correctly.
  • The LTC1609IG#PBF has a maximum junction temperature of 150°C. Ensure good airflow around the device, and use a heat sink if necessary. Avoid overheating the device, as it can affect its performance and reliability.
  • To minimize EMI and RFI, use a shielded enclosure, keep the device away from noise sources, and use a low-pass filter on the input signals. Additionally, use a common-mode choke on the power supply lines and ensure good grounding practices.

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LTC1609IG#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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