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LTC1658CMS8#PBF - Analog Devices

Description: Digital to Analog Converters - DAC 14-bit Micropower DAC in MSOP Package

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LTC1658CMS8#PBF - Analog Devices - PCB symbol
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LTC1658CMS8#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8 Package 8-Lead Plastic MSOP (LTC DWG # 05-08-1660)
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LTC1658CMS8#PBF - Analog Devices - 3D model - Small Outline Packages - MS8 Package 8-Lead Plastic MSOP (LTC DWG # 05-08-1660)
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LTC1658CMS8#PBF Details

  • Manufacturer Part Number:

    LTC1658CMS8#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PLASTIC, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1660

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Nom (tstl):

    12 µs

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC1658CMS8#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC1658CMS8 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing noise coupling between the analog and digital sections. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure accurate temperature measurement, it's essential to calibrate the device, use a high-accuracy voltage reference, and minimize thermal gradients on the PCB. Additionally, using a thermocouple with a high sensitivity and a low thermal time constant can improve accuracy.
  • The maximum cable length for the LTC1658CMS8's thermocouple input depends on the type of thermocouple and the noise environment. As a general rule, keep the cable length as short as possible (less than 10 feet) to minimize noise pickup and ensure accurate measurements.
  • While the LTC1658CMS8 is optimized for K-type thermocouples, it can be used with other thermocouple types with some modifications. However, this may require additional calibration and compensation for the specific thermocouple type being used.
  • To minimize EMI, use a shielded enclosure, keep the PCB layout compact, and use EMI filters or ferrite beads on the power and signal lines. Additionally, ensure that the thermocouple wires are twisted and shielded to reduce noise pickup.

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LTC1658CMS8#PBF Overview

Use the download button to access the LTC1658CMS8#PBF schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LTC16, or try a keyword search, such as Digital to Analog Converters

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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