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LTC1861IMS#TRPBF - Analog Devices

Description: µPower, 12-Bit, 250ksps 1- and 2-Channel ADCs in MSOP

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LTC1861IMS#TRPBF - Analog Devices - PCB symbol
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PCB Footprints
LTC1861IMS#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS Package 10-Lead Plastic MSOP (Reference LTC DWG # 05-08-1661 Rev E)-0
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LTC1861IMS#TRPBF - Analog Devices - 3D model - Small Outline Packages - MS Package 10-Lead Plastic MSOP (Reference LTC DWG # 05-08-1661 Rev E)-0
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LTC1861IMS#TRPBF Details

  • Manufacturer Part Number:

    LTC1861IMS#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    05-08-1661

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog Input Voltage-Max:

    5.25 V

  • Conversion Time-Max:

    3.2 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    2

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.25 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    1.3 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC1861IMS#TRPBF Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the LTC1861IMS#TRPBF involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and to avoid routing digital signals near the analog inputs.
  • To ensure accuracy and stability of the ADC conversion results, it's essential to follow proper PCB layout and design guidelines, use a stable and low-noise power supply, and ensure that the analog input signals are properly filtered and buffered. Additionally, it's recommended to use the internal reference voltage and to calibrate the ADC periodically to compensate for any drift or offset.
  • The maximum sampling rate of the LTC1861IMS#TRPBF is 1.5Msps, and it can be achieved by using the internal clock and setting the appropriate clock frequency. However, increasing the sampling rate will also increase the power consumption, so it's essential to balance the sampling rate with power consumption requirements in the application.
  • The LTC1861IMS#TRPBF can be interfaced with a microcontroller or FPGA using the SPI or I2C communication protocols. The recommended protocol is SPI, which provides faster data transfer rates and easier synchronization. The device can be connected to the microcontroller or FPGA using a 3-wire or 4-wire SPI interface, and the communication protocol can be implemented using the device's datasheet and application notes.
  • The LTC1861IMS#TRPBF has a maximum junction temperature of 150°C, and it's essential to ensure that the device operates within the recommended temperature range to ensure reliable operation. Thermal management considerations include using a heat sink, ensuring good airflow, and avoiding high-power dissipation components near the device. Additionally, it's recommended to use thermal simulation tools to estimate the device's junction temperature and to implement thermal monitoring and shutdown mechanisms in the application.

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LTC1861IMS#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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