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LTC2051HVCMS8#PBF - Analog Devices

Description: Linear Technology LTC2051HVCMS8#PBF Zero Drift Op Amp, 3MHz, 3 V, 5 V, 8-Pin MSOP

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LTC2051HVCMS8#PBF - Analog Devices - PCB symbol
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LTC2051HVCMS8#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8 Package 8-Lead Plastic MSOP_
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LTC2051HVCMS8#PBF - Analog Devices - 3D model - Small Outline Packages - MS8 Package 8-Lead Plastic MSOP_
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LTC2051HVCMS8#PBF Details

  • Manufacturer Part Number:

    LTC2051HVCMS8#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1660

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Average Bias Current-Max (IIB):

    0.0003 µA

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Input Offset Voltage-Max:

    3 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    2 V/us

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Width:

    3 mm

LTC2051HVCMS8#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2051 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors are of high quality and have low ESR. Additionally, adding a small resistor (e.g., 10Ω) in series with the output can help dampen oscillations.
  • The LTC2051 can handle input voltages up to 80V, but it's recommended to limit the input voltage to 60V or less to ensure reliable operation and minimize the risk of damage.
  • The LTC2051 is rated for operation up to 125°C, but its performance may degrade at high temperatures. It's recommended to derate the device's performance and ensure proper heat sinking to maintain reliability in high-temperature environments.
  • To troubleshoot issues with the LTC2051, start by verifying the input voltage, output voltage, and current. Check the PCB layout and component values to ensure they match the recommended values. Use an oscilloscope to inspect the output waveform and look for signs of oscillation or ringing. Consult the datasheet and application notes for guidance on troubleshooting specific issues.

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LTC2051HVCMS8#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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