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LTC2051HVCS8#PBF - Analog Devices

Description: Linear Technology LTC2051HVCS8#PBF, Dual Op Amp, 3MHz Rail-Rail, 3 → 9 V, 8-Pin SOIC

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LTC2051HVCS8#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - S8 Package 8-Lead Plastic Small Outline (Narrow .150 Inch)
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LTC2051HVCS8#PBF Details

  • Manufacturer Part Number:

    LTC2051HVCS8#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1610 (S8)

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Average Bias Current-Max (IIB):

    0.0003 µA

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Input Offset Voltage-Max:

    3 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    2 V/us

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Width:

    3.9 mm

LTC2051HVCS8#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2051HVCS8#PBF involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the analog power supply. Additionally, it's recommended to use a low-ESR capacitor for the VCC bypass capacitor and to keep the analog and digital grounds separate.
  • To ensure the LTC2051HVCS8#PBF operates within its specified temperature range, it's essential to provide adequate heat sinking and thermal management. This can be achieved by using a heat sink, ensuring good airflow, and keeping the device away from other heat sources.
  • The recommended input voltage range for the LTC2051HVCS8#PBF is 2.7V to 5.5V. Operating the device outside this range may affect its performance, including reduced accuracy, increased noise, and potential damage to the device.
  • To troubleshoot common issues with the LTC2051HVCS8#PBF, start by checking the PCB layout, ensuring that the device is properly powered, and verifying that the input signals are within the specified range. Also, check for noise sources, such as switching power supplies or digital signals, and ensure that the device is properly bypassed.
  • When selecting an external clock source for the LTC2051HVCS8#PBF, consider the clock frequency, jitter, and amplitude. The clock frequency should be within the specified range, and the jitter should be minimized to ensure accurate conversions. Additionally, the clock amplitude should be within the specified range to ensure proper device operation.

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LTC2051HVCS8#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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