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LTC2053IMS8-SYNC#PBF - Analog Devices

Description: INST Amp Single R-R I/O ±5.5V/11V Automotive 8-Pin MSOP Tube

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LTC2053IMS8-SYNC#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8 Package 8-Lead
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LTC2053IMS8-SYNC#PBF Details

  • Manufacturer Part Number:

    LTC2053IMS8-SYNC#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1660

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Amplifier Type:

    INSTRUMENTATION AMPLIFIER

  • Average Bias Current-Max (IIB):

    0.01 µA

  • Bandwidth (3dB)-Nom:

    0.2 MHz

  • Common-mode Reject Ratio-Min:

    95 dB

  • Input Offset Current-Max (IIO):

    0.003 µA

  • Input Offset Voltage-Max:

    20 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -5.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Non-linearity-Max:

    0.001%

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.2 V/us

  • Supply Current-Max:

    1 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC2053IMS8-SYNC#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2053 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing the bypass capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors are of high quality and have low ESR. Additionally, adding a small resistor (e.g., 10Ω) in series with the output can help dampen oscillations.
  • The maximum input voltage that the LTC2053 can handle is 5.5V. Exceeding this voltage can cause damage to the device. It's recommended to add input protection circuitry, such as a voltage clamp or a TVS diode, to prevent overvoltage conditions.
  • To synchronize the LTC2053 with an external clock, connect the clock signal to the SYNC pin. Ensure that the clock signal is within the specified frequency range (1kHz to 100kHz) and has a duty cycle of 50%. Also, make sure to add a series resistor (e.g., 1kΩ) to limit the clock signal current.
  • The typical startup time of the LTC2053 is around 10ms. However, this can vary depending on the input voltage, output load, and other factors. It's recommended to add a soft-start circuit or a startup timer to ensure a smooth startup sequence.

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LTC2053IMS8-SYNC#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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