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LTC2145IUP-14#PBF - Analog Devices

Description: 14 Bit Analog to Digital Converter 2 Input 2 Pipelined 64-QFN (9x9)

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LTC2145IUP-14#PBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UP Package 64-Lead Plastic QFN (9mm × 9mm)
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LTC2145IUP-14#PBF - Analog Devices  - 3D model - Quad Flat No-Lead - UP Package 64-Lead Plastic QFN (9mm × 9mm)
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LTC2145IUP-14#PBF Details

  • Manufacturer Part Number:

    LTC2145IUP-14#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR-5, QFN-64

  • Pin Count:

    64

  • Manufacturer Package Code:

    05-08-1705

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.C.3

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    2 V

  • Analog Input Voltage-Min:

    -2 V

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    S-PQCC-N64

  • JESD-609 Code:

    e3

  • Length:

    9 mm

  • Linearity Error-Max (EL):

    0.0159%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    2

  • Number of Bits:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    OFFSET BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    PARALLEL, WORD

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    125 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    116 mA

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

LTC2145IUP-14#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2145 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the input traces. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To optimize the performance of the LTC2145 in a noisy environment, use a low-pass filter at the input, add a ferrite bead or a common-mode choke to the power supply lines, and use a shielded enclosure to reduce electromagnetic interference (EMI).
  • The maximum clock frequency that can be used with the LTC2145 is 100 MHz. However, the actual clock frequency may be limited by the specific application and the quality of the clock signal.
  • Yes, the LTC2145 can be used in a multi-channel application. However, each channel requires a separate ADC and a separate clock signal. The channels can be synchronized using a common clock signal and a separate SYNC signal for each channel.
  • The LTC2145 has a built-in calibration feature that can be used to optimize its performance. The calibration process involves applying a known input signal and adjusting the offset and gain of the ADC to achieve optimal performance.

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LTC2145IUP-14#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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