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LTC2163CUK#PBF - Analog Devices

Description: IC ADC 16BIT PAR/SRL 80MSP 48QFN

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PCB Footprints
LTC2163CUK#PBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UK Package 48 Lead Plastic QFN (7mm x 7mm)
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LTC2163CUK#PBF - Analog Devices  - 3D model - Quad Flat No-Lead - UK Package 48 Lead Plastic QFN (7mm x 7mm)
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LTC2163CUK#PBF Details

  • Manufacturer Part Number:

    LTC2163CUK#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQCCN-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    05-08-1704

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A001.A.5.A.5

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    1.25 V

  • Analog Input Voltage-Min:

    0.7 V

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    1

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    70 °C

  • Output Bit Code:

    OFFSET BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    PARALLEL, WORD

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    105 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

LTC2163CUK#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2163CUK involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the ADC and the analog input pins. Additionally, it's recommended to use a low-ESR capacitor for the VCC pin and to decouple the VCC pin with a 0.1uF capacitor.
  • To ensure accurate conversion results, it's essential to follow proper PCB layout guidelines, use a high-quality analog input signal, and ensure that the analog input signal is within the specified range. Additionally, the ADC should be operated within its specified temperature range, and the clock frequency should be within the recommended range.
  • The maximum sampling rate of the LTC2163CUK is 125Msps. However, the actual sampling rate may be limited by the system clock frequency, the analog input signal bandwidth, and the digital output data rate.
  • Yes, the LTC2163CUK can be used in a multi-channel application. However, it's essential to ensure that the analog input signals are properly multiplexed and that the ADC is properly synchronized with the multiplexer. Additionally, the digital output data should be properly demultiplexed to obtain the individual channel data.
  • The LTC2163CUK can be interfaced with a microcontroller or FPGA using a parallel or serial interface. The parallel interface uses a 16-bit data bus, while the serial interface uses a SPI-compatible interface. The interface selection is determined by the state of the SCK/SDO pin during power-up.

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LTC2163CUK#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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