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LTC2241CUP-12#PBF - Analog Devices

Description: 12-Bit, 210Msps ADC Single 2.5V Supply, ±0.5V or ±1V,1.2GHz,–0.3V to 1V,1500mW,–65°C to 150°C

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LTC2241CUP-12#PBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - LFCSP:LEADFRM CHIP SCALE_2025-4
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LTC2241CUP-12#PBF - Analog Devices  - 3D model - Quad Flat No-Lead - LFCSP:LEADFRM CHIP SCALE_2025-4
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LTC2241CUP-12#PBF Details

  • Manufacturer Part Number:

    LTC2241CUP-12#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR5, QFN-64

  • Pin Count:

    64

  • Manufacturer Package Code:

    05-08-1705

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.C.2

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    1 V

  • Analog Input Voltage-Min:

    -1 V

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    S-PQCC-N64

  • JESD-609 Code:

    e3

  • Length:

    9 mm

  • Linearity Error-Max (EL):

    0.0562%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    70 °C

  • Output Bit Code:

    OFFSET BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    PARALLEL, WORD

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    210 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    2.5 mA

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

LTC2241CUP-12#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2241CUP-12 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the input traces. Additionally, it's recommended to place the device close to the analog signal sources and to use a low-impedance power supply.
  • To ensure proper powering and decoupling of the LTC2241CUP-12, use a low-impedance power supply, and add decoupling capacitors (e.g., 0.1uF and 10uF) between the power pins and ground. Place these capacitors as close to the device as possible.
  • The maximum clock frequency for the LTC2241CUP-12 is 80MHz. However, the actual clock frequency may be limited by the specific application and the quality of the clock signal.
  • The digital output data from the LTC2241CUP-12 is in a 12-bit parallel format. To handle this data, use a microcontroller or FPGA with a parallel input interface, or use a serial interface such as SPI or I2C with a suitable converter.
  • The typical power consumption of the LTC2241CUP-12 is around 350mW at a supply voltage of 3.3V and a clock frequency of 65MHz. However, this value may vary depending on the specific application and operating conditions.

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LTC2241CUP-12#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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