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LTC2612CMS8#PBF - Analog Devices

Description: Linear Technology LTC2612CMS8#PBF, 2-channel 14 bit Serial DAC, 8-Pin MSOP

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LTC2612CMS8#PBF - Analog Devices - PCB symbol
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LTC2612CMS8#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8 8-Lead Plastic MSOP_2020
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LTC2612CMS8#PBF - Analog Devices - 3D model - Small Outline Packages - MS8 8-Lead Plastic MSOP_2020
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LTC2612CMS8#PBF Details

  • Manufacturer Part Number:

    LTC2612CMS8#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1660

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Output Voltage-Max:

    5.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0977%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Nom (tstl):

    9 µs

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC2612CMS8#PBF Frequently Asked Questions (FAQs)

  • A good layout and routing practice for the LTC2612CMS8#PBF involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the IC and the capacitors. It's also recommended to use a low-ESR capacitor for the VCC pin and to place the bypass capacitors close to the IC.
  • To ensure the LTC2612CMS8#PBF operates within its specified temperature range, it's essential to provide adequate heat sinking and thermal management. This can be achieved by using a heat sink, ensuring good airflow, and keeping the device away from other heat sources.
  • Not using the recommended capacitors for the LTC2612CMS8#PBF can lead to reduced performance, increased noise, and potential instability. The recommended capacitors are chosen to ensure the device operates within its specified parameters, and substituting them with other capacitors may compromise the device's performance.
  • To troubleshoot issues with the LTC2612CMS8#PBF, start by verifying the power supply voltage, checking for proper grounding and decoupling, and ensuring the input and output capacitors are correctly connected. Use an oscilloscope to monitor the output voltage and check for any signs of oscillation or noise.
  • The LTC2612CMS8#PBF is a commercial-grade device, and its reliability and temperature range may not be suitable for high-reliability or high-temperature applications. For such applications, consider using a device with a higher temperature range and reliability rating, such as the industrial or automotive grade versions.

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LTC2612CMS8#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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