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LTC2655IGN-L12#PBF - Analog Devices

Description: Digital to Analog Converters - DAC 12-Bit I2C Quad DAC (1.25V Reference)

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LTC2655IGN-L12#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 16-Lead Plastic SSOP (Narrow .150 Inch)
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LTC2655IGN-L12#PBF - Analog Devices  - 3D model - Small Outline Packages - 16-Lead Plastic SSOP (Narrow .150 Inch)
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LTC2655IGN-L12#PBF Details

  • Manufacturer Part Number:

    LTC2655IGN-L12#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1641 (GN16)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog Output Voltage-Max:

    2.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Settling Time-Nom (tstl):

    2.4 µs

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

LTC2655IGN-L12#PBF Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the LTC2655IGN-L12#PBF involves keeping the device away from high-frequency noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a separate ground plane to minimize noise and ensure optimal performance.
  • The LTC2655IGN-L12#PBF requires a single 3.3V or 5V power supply, and it's recommended to use a low-noise, low-dropout regulator to power the device. The power sequencing requirements involve powering up the device in the following order: VCC, followed by the input voltage (VIN), and then the output voltage (VOUT).
  • The maximum operating temperature range for the LTC2655IGN-L12#PBF is -40°C to 125°C. Temperature can affect the device's performance, particularly its accuracy and linearity. It's recommended to operate the device within the specified temperature range to ensure optimal performance.
  • The LTC2655IGN-L12#PBF can be programmed using a serial interface, such as SPI or I2C, to configure the device's settings, including the output voltage, output current, and fault detection. The device also has a dedicated pin for programming the output voltage.
  • The LTC2655IGN-L12#PBF is available in a 16-lead QFN package, which provides a compact and low-profile solution for space-constrained applications. The pinout is optimized for ease of use and minimizes the number of external components required.

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LTC2655IGN-L12#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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