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LTC2877IMSE#TRPBF - Analog Devices

Description: ±60V Rugged PROFIBUS RS485 Transceivers

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PCB Footprints
LTC2877IMSE#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSE Package 10-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1664 Rev I)-1
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3D Models
LTC2877IMSE#TRPBF - Analog Devices  - 3D model - Small Outline Packages - MSE Package 10-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1664 Rev I)-1
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LTC2877IMSE#TRPBF Details

  • Manufacturer Part Number:

    LTC2877IMSE#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    05-08-1664

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    ALSO OPERATE WITH 3V SUPPLY

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    DIFFERENTIAL

  • Output Low Current-Max:

    0.003 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    70 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    50 ns

  • Width:

    3 mm

LTC2877IMSE#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2877IMSE involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer board with a dedicated layer for the analog signals.
  • To ensure reliable communication over the SPI interface, make sure to use a pull-up resistor on the SCK line, keep the clock frequency within the recommended range, and use a valid slave select signal. Also, ensure that the SPI bus is not overloaded and that the master device is properly configured.
  • The maximum cable length for the RS-485 interface depends on the baud rate and the cable characteristics. As a general rule, the maximum cable length is 4000 feet at 9600bps, 1000 feet at 19200bps, and 500 feet at 38400bps. However, it's recommended to consult the RS-485 standard and perform signal integrity analysis for specific applications.
  • To handle ESD protection for the LTC2877IMSE, it's recommended to use a TVS diode or an ESD protection device on the RS-485 lines and the power supply lines. Additionally, ensure that the PCB design and layout follow good ESD protection practices, such as using a ground plane and keeping sensitive components away from the board edges.
  • The recommended power-up sequence for the LTC2877IMSE is to apply the power supply voltage (VCC) first, followed by the logic supply voltage (VDD). Ensure that the power supplies are stable and within the recommended voltage range before applying the logic signals.

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LTC2877IMSE#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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