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LTC2917IMS-A1#PBF - Analog Devices

Description: Linear Technology LTC2917IMS-A1#PBF, Voltage Supervisor

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LTC2917IMS-A1#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS Package 10-Lead Plastic MSOP (Reference LTC DWG # 05-08-1661 Rev F)
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LTC2917IMS-A1#PBF - Analog Devices  - 3D model - Small Outline Packages - MS Package 10-Lead Plastic MSOP (Reference LTC DWG # 05-08-1661 Rev F)
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LTC2917IMS-A1#PBF Details

  • Manufacturer Part Number:

    LTC2917IMS-A1#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    05-08-1661

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.5 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC2917IMS-A1#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2917IMS-A1#PBF involves keeping the input and output traces short and wide, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper powering and decoupling of the LTC2917IMS-A1#PBF, use a high-quality, low-ESR capacitor (e.g., 10uF ceramic) between the VIN pin and GND, and a 1uF ceramic capacitor between the VCC pin and GND. Also, ensure that the power supply is clean and well-regulated.
  • The maximum ambient temperature range for the LTC2917IMS-A1#PBF is -40°C to 125°C. However, the device's performance may degrade at extreme temperatures, so it's recommended to operate within a range of 0°C to 85°C for optimal performance.
  • While the LTC2917IMS-A1#PBF is a high-quality device, it's essential to evaluate its suitability for high-reliability or safety-critical applications. Consult with Analog Devices Inc. or a qualified reliability engineer to determine the device's fitness for use in such applications.
  • To troubleshoot issues with the LTC2917IMS-A1#PBF, start by verifying the power supply and decoupling, then check the input and output signals using an oscilloscope. Consult the datasheet and application notes for guidance on troubleshooting common issues. If the problem persists, contact Analog Devices Inc. or a qualified engineer for assistance.

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LTC2917IMS-A1#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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