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LTC3265EFE#TRPBF - Analog Devices

Description: Switching Voltage Regulators Low Noise Dual Supply with Boost and Inverting Charge Pumps

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LTC3265EFE#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP_20_2021
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LTC3265EFE#TRPBF - Analog Devices  - 3D model - Small Outline Packages - TSSOP_20_2021
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LTC3265EFE#TRPBF Details

  • Manufacturer Part Number:

    LTC3265EFE#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    05-08-1663 (CA)

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    ALSO VOUT=20 VOLT

  • Analog IC - Other Type:

    SWITCHED CAPACITOR REGULATOR

  • Input Voltage-Max:

    16 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    10 V

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Output Voltage-Nom:

    18.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.2 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    INVERTER

  • Switching Frequency-Max:

    500 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

LTC3265EFE#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC3265EFE involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the input and output capacitors are of high quality and have low ESR. Also, avoid using long traces and vias near the device, and keep the feedback network as short as possible.
  • The LTC3265EFE is rated for operation from -40°C to 125°C ambient temperature range. However, the device's performance and reliability may degrade at extreme temperatures, so it's recommended to operate within a narrower range (e.g., 0°C to 85°C) for optimal performance.
  • The LTC3265EFE is a surface-mount device and can be susceptible to vibration-induced failures. To ensure reliability in high-vibration environments, it's recommended to use a robust PCB design, secure the device with a suitable adhesive or mechanical fastening, and consider using a vibration-dampening material or potting compound.
  • To troubleshoot issues with the LTC3265EFE, start by verifying the input voltage, output voltage, and current. Check for proper component values, PCB layout, and soldering quality. Use an oscilloscope to monitor the output voltage and current waveforms, and check for signs of oscillation or instability. Consult the datasheet and application notes for guidance on troubleshooting specific issues.

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LTC3265EFE#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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