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LTC3265HFE#PBF - Analog Devices

Description: LINEAR TECHNOLOGY - LTC3265HFE#PBF - DC/DC Adjustable Charge Pump Voltage Converter & Inverter, 4.5-32V in, 50 mA out, 500 kHz, TSSOP-20

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LTC3265HFE#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - FE Package 20-Lead Plastic TSSOP (4.4mm)-1
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LTC3265HFE#PBF - Analog Devices  - 3D model - Small Outline Packages - FE Package 20-Lead Plastic TSSOP (4.4mm)-1
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LTC3265HFE#PBF Details

  • Manufacturer Part Number:

    LTC3265HFE#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    05-08-1663 (CA)

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    ALSO VOUT=20 VOLT

  • Analog IC - Other Type:

    SWITCHED CAPACITOR REGULATOR

  • Input Voltage-Max:

    16 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    10 V

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Nom:

    18.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    INVERTER

  • Switching Frequency-Max:

    500 kHz

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

LTC3265HFE#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC3265HFE#PBF involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The input capacitor should have a low ESR and be rated for the maximum input voltage. A 10uF to 22uF ceramic capacitor is a good choice. The output capacitor should also have a low ESR and be rated for the maximum output voltage. A 10uF to 47uF ceramic capacitor is a good choice. X5R or X7R dielectrics are recommended.
  • The LTC3265HFE#PBF can operate in ambient temperatures up to 125°C. However, the device's performance and reliability may degrade at higher temperatures, so it's recommended to keep the ambient temperature below 85°C for optimal performance.
  • Yes, the LTC3265HFE#PBF is designed to operate in high-vibration environments. However, it's recommended to follow proper PCB mounting and assembly techniques to ensure that the device is securely attached to the PCB and can withstand the vibration.
  • To troubleshoot issues with the LTC3265HFE#PBF, start by checking the input and output voltages, and the device's operating frequency. Use an oscilloscope to check for any unusual waveforms or noise. Check the PCB layout and assembly for any errors or defects. Consult the datasheet and application notes for troubleshooting guides and tips.

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LTC3265HFE#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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