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LTC3413IFE#TRPBF - Analog Devices

Description: 3A, 2MHz Monolithic Synchronous Regulator for DDR/QDR Memory Termination

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LTC3413IFE#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - FE Package 16-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663 Rev L) Exposed Pad Variation BA
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3D Models
LTC3413IFE#TRPBF - Analog Devices  - 3D model - Small Outline Packages - FE Package 16-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663 Rev L) Exposed Pad Variation BA
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LTC3413IFE#TRPBF Details

  • Manufacturer Part Number:

    LTC3413IFE#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    4.40 MM, LEAD FREE, PLASTIC, TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1663 (BA)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.25 V

  • Input Voltage-Nom:

    3.3 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    7.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2000 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LTC3413IFE#TRPBF Frequently Asked Questions (FAQs)

  • The maximum input voltage that can be applied to the VIN pin is 15V, but it's recommended to keep it below 12V for optimal performance and reliability.
  • To ensure the stability of the output voltage, make sure to use a suitable output capacitor with a low ESR (Equivalent Series Resistance) and a sufficient capacitance value, as recommended in the datasheet. Additionally, ensure that the input voltage is within the recommended range and the output current is within the specified limits.
  • The maximum output current that can be drawn from the LTC3413IFE is 1.5A, but it's recommended to keep it below 1.2A for optimal performance and reliability.
  • The soft-start feature of the LTC3413IFE can be configured by connecting a capacitor from the SS pin to GND. The value of the capacitor determines the soft-start time, with larger values resulting in longer soft-start times.
  • The PG (Power Good) pin is an open-drain output that indicates when the output voltage is within regulation. It can be used to monitor the output voltage and generate a reset signal or an interrupt to the system controller. To use the PG pin, connect it to a pull-up resistor and a logic input, and monitor the signal to determine when the output voltage is within regulation.

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LTC3413IFE#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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