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LTC3417AEFE-2#PBF - Analog Devices

Description: Switching Voltage Regulators Dual, Sync. 1.5A/1A, 4MHz Step-Down DC/DC

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LTC3417AEFE-2#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - FE Package 20-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663)
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LTC3417AEFE-2#PBF - Analog Devices  - 3D model - Small Outline Packages - FE Package 20-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663)
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LTC3417AEFE-2#PBF Details

  • Manufacturer Part Number:

    LTC3417AEFE-2#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    05-08-1663 (CA)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    DUAL SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    BURST MODE

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.25 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.5 A

  • Output Voltage-Max:

    5 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max (Isup):

    0.6 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    4000 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LTC3417AEFE-2#PBF Frequently Asked Questions (FAQs)

  • The maximum input voltage that can be applied to the VIN pin is 15V, but it's recommended to keep it below 12V for optimal performance and reliability.
  • To ensure the stability of the output voltage, make sure to use a minimum output capacitance of 10uF, and a maximum ESR of 1 ohm. Also, use a low-ESR capacitor for the input capacitor (CIN) to minimize input voltage ripple.
  • The maximum output current that the LTC3417AEFE-2 can deliver is 1.5A. However, the output current should be derated based on the input voltage, output voltage, and ambient temperature.
  • The soft-start feature of the LTC3417AEFE-2 can be configured by connecting a capacitor (CSS) from the SS pin to GND. The soft-start time is determined by the value of CSS, with a larger capacitor resulting in a slower soft-start time.
  • The PG (Power Good) pin is an open-drain output that indicates when the output voltage is within regulation. It can be used to reset a microcontroller or other devices when the output voltage is stable. Connect a pull-up resistor from the PG pin to a voltage source, and use the PG pin as an input to the microcontroller or other devices.

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LTC3417AEFE-2#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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