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LTC3553EUD-2#PBF - Analog Devices

Description: Micropower USB Power Manager with Li-Ion Charger, Always-On LDO and Buck Regulator

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LTC3553EUD-2#PBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UD Package 20-Lead Plastic QFN (3mm × 3mm)
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3D Models
LTC3553EUD-2#PBF - Analog Devices  - 3D model - Quad Flat No-Lead - UD Package 20-Lead Plastic QFN (3mm × 3mm)
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LTC3553EUD-2#PBF Details

  • Manufacturer Part Number:

    LTC3553EUD-2#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    20

  • Manufacturer Package Code:

    05-08-1720

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LINEAR BATTERY CHARGER

  • JESD-30 Code:

    S-PQCC-N20

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.35 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC3553EUD-2#PBF Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the LTC3553EUD-2#PBF involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it is recommended to place the device away from high-frequency noise sources and to use shielding or guard rings to reduce EMI.
  • To optimize the performance of the LTC3553EUD-2#PBF in a high-temperature environment, it is recommended to use a heat sink to dissipate heat, reduce the input voltage to minimize power dissipation, and ensure good airflow around the device. Additionally, the device's thermal shutdown feature can be used to protect it from overheating.
  • The maximum input voltage that can be applied to the LTC3553EUD-2#PBF without damaging the device is 15V. Exceeding this voltage can cause permanent damage to the device.
  • To troubleshoot issues with the LTC3553EUD-2#PBF, it is recommended to check the input voltage, output voltage, and output current using an oscilloscope or multimeter. Additionally, check the device's thermal shutdown feature, ensure that the input and output capacitors are properly connected, and verify that the device is properly configured and enabled.
  • Yes, the LTC3553EUD-2#PBF can be used in a battery-powered application. To optimize its power consumption, it is recommended to use a low-input voltage, enable the device's power-saving features, and use a low-quiescent current mode. Additionally, consider using a low-dropout regulator or a switching regulator to minimize power loss.

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LTC3553EUD-2#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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