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LTC3601IMSE#PBF - Analog Devices

Description: Linear Technology, LTC3601IMSE#PBF DC-DC Converter 1.5A, 16-Pin MSOP

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LTC3601IMSE#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSE(MSOP)
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LTC3601IMSE#PBF - Analog Devices - 3D model - Small Outline Packages - MSE(MSOP)
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LTC3601IMSE#PBF Details

  • Manufacturer Part Number:

    LTC3601IMSE#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, MSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1667

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    BURST MODE

  • Input Voltage-Max:

    15 V

  • Input Voltage-Min:

    4 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.039 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2.8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    4600 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC3601IMSE#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC3601IMSE involves keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing the length of the traces between the IC and the capacitors. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To optimize the performance of the LTC3601IMSE, ensure that the input voltage is within the recommended range, use high-quality capacitors with low ESR, and minimize the noise on the input and output lines. Additionally, ensure that the PCB layout is optimized for low noise and good thermal performance.
  • The maximum ambient temperature for the LTC3601IMSE is 85°C. However, the device can operate at higher temperatures with derating. Consult the datasheet for more information on thermal derating.
  • Yes, the LTC3601IMSE is suitable for high-reliability applications. It is manufactured using a high-reliability process and is screened to ensure high reliability. However, it is essential to follow proper design and manufacturing practices to ensure the reliability of the final product.
  • To troubleshoot issues with the LTC3601IMSE, start by checking the input voltage, output voltage, and current. Verify that the input and output capacitors are properly connected and that the PCB layout is correct. Use an oscilloscope to check for noise and oscillations on the input and output lines. Consult the datasheet and application notes for more troubleshooting tips.

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LTC3601IMSE#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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