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LTC3634HUFD#PBF - Analog Devices

Description: LINEAR TECHNOLOGY - LTC3634HUFD#PBF - DC-DC REGULATOR, BUCK, , QFN-28

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LTC3634HUFD#PBF - Analog Devices - PCB symbol
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LTC3634HUFD#PBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UFD Package 28-Lead Plastic QFN (4mm × 5mm)_2022
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LTC3634HUFD#PBF - Analog Devices - 3D model - Quad Flat No-Lead - UFD Package 28-Lead Plastic QFN (4mm × 5mm)_2022
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LTC3634HUFD#PBF Details

  • Manufacturer Part Number:

    LTC3634HUFD#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    5 X 4 MM, LEAD FREE, PLASTIC, MO-220WXXX-X, QFN-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    05-08-1712

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    ALSO OPERATES IN ADJUSTABLE MODE FROM 0.6 TO 3V

  • Analog IC - Other Type:

    DUAL SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Input Voltage-Max:

    15 V

  • Input Voltage-Min:

    1.4 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PQCC-N28

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Output Voltage-Max:

    3 V

  • Output Voltage-Min:

    0.6 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    4000 kHz

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

LTC3634HUFD#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC3634 involves keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing the length of the traces between the IC and the capacitors. Additionally, it's recommended to use a separate analog and digital ground plane to reduce noise coupling.
  • The input capacitor should be a low-ESR ceramic capacitor with a value between 4.7uF to 10uF, while the output capacitor should be a low-ESR ceramic or tantalum capacitor with a value between 10uF to 22uF. The capacitor selection also depends on the specific application requirements, such as ripple current and voltage rating.
  • The LTC3634 is rated for operation from -40°C to 125°C, but the maximum ambient temperature range depends on the specific application and the thermal design of the system. It's recommended to follow the thermal design guidelines in the datasheet to ensure reliable operation.
  • The LTC3634 has a resistive divider network that sets the output voltage. The output voltage can be programmed by selecting the appropriate resistors for the divider network. The datasheet provides a formula to calculate the resistor values for a specific output voltage.
  • The LTC3634 can operate from a minimum input voltage of 2.7V to a maximum input voltage of 5.5V. However, the maximum input voltage range depends on the specific application and the output voltage setting.

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LTC3634HUFD#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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