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LTC3822EDD#PBF - Analog Devices

Description: No RSENSE™, Low Input Voltage, Synchronous Step-Down DC/DC Controller

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PCB Footprints
LTC3822EDD#PBF - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - DD Package 10-Lead Plastic DFN (3mm × 3mm) (Reference LTC DWG # 05-08-1699 Rev C)-2025
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3D Models
LTC3822EDD#PBF - Analog Devices  - 3D model - Small Outline No-lead - DD Package 10-Lead Plastic DFN (3mm × 3mm) (Reference LTC DWG # 05-08-1699 Rev C)-2025
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LTC3822EDD#PBF Details

  • Manufacturer Part Number:

    LTC3822EDD#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    3 X 3 MM, LEAD FREE, PLASTIC, MO-229WEED-2, DFN-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    05-08-1699

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    CONSTANT FREQUENCY

  • Input Voltage-Max:

    4.5 V

  • Input Voltage-Min:

    2.75 V

  • Input Voltage-Nom:

    3.3 V

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    0.5 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    PUSH-PULL

  • Switching Frequency-Max:

    850 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC3822EDD#PBF Frequently Asked Questions (FAQs)

  • The maximum input voltage that can be applied to the LTC3822EDD is 60V, but it's recommended to keep it below 50V for reliable operation.
  • The compensation network can be optimized by following the guidelines in the datasheet and using the provided equations to calculate the values of the compensation components. Additionally, simulation tools such as LTspice can be used to fine-tune the compensation network.
  • The recommended layout and placement for the LTC3822EDD involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. A 4-layer PCB with a dedicated power plane is also recommended.
  • Thermal management of the LTC3822EDD involves providing adequate heat sinking, such as a thermal pad or a heat sink, and ensuring good airflow around the device. The device's thermal resistance and maximum junction temperature should also be considered when designing the thermal management system.
  • The LTC3822EDD has a higher input voltage range and a lower quiescent current compared to other similar devices from Analog Devices. It also has a more comprehensive set of protection features, including overvoltage protection and undervoltage lockout.

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LTC3822EDD#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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