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LTC3851IMSE#PBF - Analog Devices

Description: Synchronous Step-Down Switching Regulator Controller

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LTC3851IMSE#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSE Package 16-Lead Plastic MSOP, Exposed Die Pad*
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LTC3851IMSE#PBF - Analog Devices  - 3D model - Small Outline Packages - MSE Package 16-Lead Plastic MSOP, Exposed Die Pad*
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LTC3851IMSE#PBF Details

  • Manufacturer Part Number:

    LTC3851IMSE#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1667

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    38 V

  • Input Voltage-Min:

    4 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.039 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.05 A

  • Output Voltage-Max:

    5.5 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP16,.19,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    PUSH-PULL

  • Switching Frequency-Max:

    790 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC3851IMSE#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC3851IMSE involves keeping the high-current paths short and wide, using a solid ground plane, and placing the input capacitors close to the IC. A 4-layer board with a dedicated power plane is recommended. Refer to the application note AN140 for more details.
  • Choose input capacitors with a voltage rating of at least 1.5 times the maximum input voltage, and a capacitance value of 10uF to 22uF. X5R or X7R ceramic capacitors are recommended due to their low ESR and high ripple current capability.
  • The maximum ambient temperature for the LTC3851IMSE is 85°C, but it can be derated to 70°C for high-reliability applications. The junction temperature should not exceed 125°C.
  • Yes, the LTC3851IMSE is designed to withstand high-vibration environments. However, it's essential to ensure that the PCB is properly secured and the components are properly soldered to prevent mechanical stress.
  • Start by checking the input voltage, output voltage, and current. Verify that the input capacitors are properly connected and the output voltage is within the specified range. Check for any signs of overheating, and ensure that the PCB layout is correct. Refer to the datasheet and application notes for more troubleshooting tips.

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LTC3851IMSE#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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