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LTC3859EFE#TRPBF - Analog Devices

Description: Low IQ, Triple Output, Buck/Buck/Boost Synchronous Controller

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LTC3859EFE#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - FE Package 38-Lead Plastic TSSOP (4.4mm)
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LTC3859EFE#TRPBF - Analog Devices  - 3D model - Small Outline Packages - FE Package 38-Lead Plastic TSSOP (4.4mm)
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LTC3859EFE#TRPBF Details

  • Manufacturer Part Number:

    LTC3859EFE#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    4.40 MM, LEAD FREE, PLASTIC, TSSOP-38

  • Pin Count:

    38

  • Manufacturer Package Code:

    05-08-1772

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    ALSO OPERATES IN ADJUSTABLE MODE FROM 0.8 TO 24V

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    38 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G38

  • JESD-609 Code:

    e3

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    85 °C

  • Output Voltage-Max:

    24 V

  • Output Voltage-Min:

    0.8 V

  • Output Voltage-Nom:

    5.4 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    PUSH-PULL

  • Switching Frequency-Max:

    900 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LTC3859EFE#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC3859EFE involves keeping the high-current paths short and wide, using multiple vias to connect the GND pins to the ground plane, and placing the input capacitors close to the VIN pin. A 4-layer board with a solid ground plane is recommended.
  • The compensation network for the LTC3859EFE involves selecting the right values for the RC network connected to the COMP pin. A good starting point is to use the values recommended in the datasheet, and then adjust them based on the specific application requirements and the output voltage ripple.
  • The maximum junction temperature for the LTC3859EFE is 150°C. It's essential to ensure that the device operates within the recommended temperature range to prevent overheating and ensure reliable operation.
  • Yes, the LTC3859EFE is suitable for high-reliability applications. It's manufactured using a high-reliability process, and it's qualified to various industry standards, including automotive and industrial specifications.
  • The LTC3859EFE has built-in overvoltage protection (OVP) and undervoltage lockout (UVLO) features. However, additional protection can be added using external components, such as a voltage supervisor or a crowbar circuit, to ensure that the device operates within the recommended voltage range.

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LTC3859EFE#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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