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LTC3894HFE#PBF - Analog Devices

Description: Buck Regulator Positive Output Step-Down DC-DC Controller IC 20-TSSOP-EP , 4.5V ~ 150V , -40°C ~ 125°C (TJ)

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LTC3894HFE#PBF - Analog Devices PCB footprint - Other - Other - FE Package Variation: FE20(16) 20-Lead Plastic TSSOP (4.4mm)_-
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LTC3894HFE#PBF - Analog Devices  - 3D model - Other - FE Package Variation: FE20(16) 20-Lead Plastic TSSOP (4.4mm)_-
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LTC3894HFE#PBF Details

  • Manufacturer Part Number:

    LTC3894HFE#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-20/16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1924

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2019-07-22

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    BURST MODE

  • Input Voltage-Max:

    150 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    60 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.2 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    850 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

LTC3894HFE#PBF Frequently Asked Questions (FAQs)

  • The maximum junction temperature of the LTC3894HFE is 125°C. However, it's recommended to keep the junction temperature below 100°C for reliable operation and to ensure the device meets its specifications.
  • To minimize EMI and noise, it's essential to follow good PCB layout practices. Keep the power stage components close together, use a solid ground plane, and keep the high-frequency nodes (e.g., SW node) away from sensitive analog nodes. Additionally, use shielding and filtering components, such as ferrite beads and capacitors, to reduce EMI.
  • The recommended input capacitor type is a low-ESR ceramic capacitor with a value between 10uF to 22uF. The capacitor should be placed close to the VIN pin and have a voltage rating that exceeds the maximum input voltage.
  • The inductor value and type depend on the specific application requirements, such as output voltage, output current, and switching frequency. As a general guideline, use a low-loss inductor with a value between 1uH to 10uH and a saturation current rating that exceeds the peak inductor current. Consult the datasheet and application notes for more detailed guidance.
  • The SYNC/MODE pin allows the user to synchronize the switching frequency of the LTC3894HFE with an external clock signal or to select between forced continuous conduction mode (FCCM) and pulse-skip mode. To use this pin, connect it to an external clock signal or tie it to a logic level (e.g., GND or VIN) to select the desired mode.

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LTC3894HFE#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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