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LTC3899EFE#PBF - Analog Devices

Description: 60V Low IQ, Triple Output, Buck/Buck/Boost Synchronous Controller with PassThru

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LTC3899EFE#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTC3899EFE#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - FE Package 38-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1772 Rev C) Exposed Pad Variation AA
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3D Models
LTC3899EFE#PBF - Analog Devices - 3D model - Small Outline Packages - FE Package 38-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1772 Rev C) Exposed Pad Variation AA
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LTC3899EFE#PBF Details

  • Manufacturer Part Number:

    LTC3899EFE#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-38

  • Pin Count:

    38

  • Manufacturer Package Code:

    05-08-1772

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    ALSO OPERATES AT 10V

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    60 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G38

  • JESD-609 Code:

    e3

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    85 °C

  • Output Voltage-Max:

    60 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP38,.25,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.2 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    900 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

LTC3899EFE#PBF Frequently Asked Questions (FAQs)

  • The maximum input voltage that can be applied to the VIN pin is 60V, but it's recommended to keep it below 50V for reliable operation.
  • To ensure stability, make sure to follow the recommended layout and component selection guidelines, including the use of a suitable output capacitor and a low-ESR input capacitor. Additionally, ensure that the feedback resistors are properly selected and the compensation network is correctly configured.
  • Yes, the LTC3899EFE is rated for operation up to 125°C, but it's essential to follow the recommended thermal design and layout guidelines to ensure reliable operation. Additionally, consider the derating of the device's performance and power handling at high temperatures.
  • The soft-start function can be configured by connecting a capacitor from the SS pin to ground. The value of the capacitor determines the soft-start time, with larger values resulting in slower start-up times. A recommended value is 10nF to 100nF.
  • The TRIM pin is used to adjust the output voltage of the regulator. By connecting a resistor from the TRIM pin to ground, the output voltage can be adjusted up or down by a small amount (typically ±1%). This allows for fine-tuning of the output voltage to meet specific application requirements.

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LTC3899EFE#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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