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LTC4091EDJC#TRPBF - Analog Devices

Description: Battery Management 36V Battery Charger and Power Backup Manager

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PCB Footprints
LTC4091EDJC#TRPBF - Analog Devices PCB footprint - Other - Other - DJC Package 22-Lead Plastic DFN (6mm × 3mm)
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3D Models
LTC4091EDJC#TRPBF - Analog Devices  - 3D model - Other - DJC Package 22-Lead Plastic DFN (6mm × 3mm)
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LTC4091EDJC#TRPBF Details

  • Manufacturer Part Number:

    LTC4091EDJC#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-22

  • Pin Count:

    22

  • Manufacturer Package Code:

    05-08-1714

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LINEAR BATTERY CHARGER

  • JESD-30 Code:

    R-PDSO-N22

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC22,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    36 V

  • Supply Voltage-Min (Vsup):

    6 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +38V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC4091EDJC#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC4091EDJC involves keeping the high-frequency switching nodes (e.g., SW, VIN) away from sensitive analog nodes (e.g., VOUT, FB). Use a solid ground plane, and keep the input and output capacitors close to the IC. A 4-layer board with a dedicated power plane is recommended.
  • Choose an inductor with a high saturation current rating, low DC resistance, and a suitable inductance value (e.g., 1-10uH). Consider the inductor's physical size, core material, and operating frequency. A good starting point is to use an inductor with a saturation current rating of at least 1.5 times the maximum output current.
  • The maximum ambient temperature for the LTC4091EDJC is 85°C. However, the device's junction temperature (TJ) should not exceed 125°C. Ensure proper thermal design and heat sinking to maintain a safe operating temperature.
  • Yes, the LTC4091EDJC is suitable for high-vibration environments. However, ensure that the PCB is properly secured and the components are well-soldered. Consider using a vibration-resistant inductor and capacitors, and follow proper PCB design and assembly practices.
  • Start by checking the input voltage, output voltage, and current. Verify that the feedback loop is properly connected and that the compensation components are correct. Use an oscilloscope to check for switching frequency, voltage ripple, and current waveforms. Consult the datasheet and application notes for troubleshooting guidelines.

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LTC4091EDJC#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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