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LTC4222IG#PBF - Analog Devices

Description: Hot Swap Voltage Controllers 2x Hot Swap Cntr w/ I2C Compatible Mon i -40°C ~ 85°C,36-SSOP,29V

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LTC4222IG#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - G Package 36-Lead Plastic SSOP (5.3mm)
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LTC4222IG#PBF - Analog Devices  - 3D model - Small Outline Packages - G Package 36-Lead Plastic SSOP (5.3mm)
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LTC4222IG#PBF Details

  • Manufacturer Part Number:

    LTC4222IG#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    5.30 MM, LEAD FREE, PLASTIC, SSOP-36

  • Pin Count:

    36

  • Manufacturer Package Code:

    05-08-1640 (G36)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    HOT SWAP CONTROLLER

  • JESD-30 Code:

    R-PDSO-G36

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max (Vsup):

    29 V

  • Supply Voltage-Min (Vsup):

    2.9 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.3 mm

LTC4222IG#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC4222IG involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help to reduce noise and improve performance.
  • The LTC4222IG requires a single 3.3V or 5V power supply. It's recommended to power the device from a low-noise, low-impedance source. Power sequencing is not critical, but it's recommended to power the device after the input voltage has stabilized.
  • The maximum current that the LTC4222IG can handle is 2A. To calculate the maximum current rating, you need to consider the input voltage, output voltage, and the current drawn by the load. The maximum current rating can be calculated using the formula: I_max = (Vin - Vout) / Rds(on).
  • To protect the LTC4222IG from overvoltage and undervoltage conditions, you can use a voltage supervisor or a voltage monitor IC to monitor the input voltage and shut down the device if the voltage exceeds the recommended range. Additionally, you can use a TVS diode or a zener diode to clamp the input voltage and prevent overvoltage conditions.
  • The thermal management strategy for the LTC4222IG involves using a heat sink or a thermal pad to dissipate heat. The junction temperature can be calculated using the formula: Tj = Ta + (PD x θJA), where Ta is the ambient temperature, PD is the power dissipation, and θJA is the junction-to-ambient thermal resistance.

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LTC4222IG#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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