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LTC4229IUFD#PBF - Analog Devices

Description: Hot Swap Voltage Controllers Ideal Diode and Hot Swap Controller

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PCB Footprints
LTC4229IUFD#PBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 24-Lead (4mm × 5mm) Plastic QFN
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LTC4229IUFD#PBF - Analog Devices  - 3D model - Quad Flat No-Lead - 24-Lead (4mm × 5mm) Plastic QFN
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LTC4229IUFD#PBF Details

  • Manufacturer Part Number:

    LTC4229IUFD#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    05-08-1696

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    SEATED HT-CALCULATED

  • Analog IC - Other Type:

    HOT SWAP CONTROLLER

  • JESD-30 Code:

    R-PQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16X.2,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    4 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    2.9 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

LTC4229IUFD#PBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output capacitors close to the IC, and use short, wide traces for the power paths.
  • Follow the recommended power-up sequence: VCC, then VIN, then EN. Ensure the EN pin is high before applying VIN. Also, configure the FAULT pin as an open-drain output to prevent backdrive.
  • The LTC4229IUFD has a thermal pad on the bottom of the package. Ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Keep the junction temperature below 125°C.
  • Use a scope to monitor the input and output voltages, and check for proper power-up sequencing. Verify the FAULT pin is not asserted, and check for overheating or excessive current draw.
  • Yes, the LTC4229IUFD is qualified for automotive and high-reliability applications. However, ensure you follow the recommended operating conditions, and consult with Analog Devices Inc. for specific requirements and certifications.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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