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LTC4267CGN-1#PBF - Analog Devices

Description: Power over Ethernet IEEE 802.3af PD Interface with Integrated Switching Regulator

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LTC4267CGN-1#PBF - Analog Devices - PCB symbol
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LTC4267CGN-1#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - GN Package 16-Lead Plastic SSOP (Narrow .150 Inch)
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LTC4267CGN-1#PBF - Analog Devices - 3D model - Small Outline Packages - GN Package 16-Lead Plastic SSOP (Narrow .150 Inch)
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LTC4267CGN-1#PBF Details

  • Manufacturer Part Number:

    LTC4267CGN-1#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.150 INCH, LEAD FREE, PLASTIC, SSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1641 (GN16)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    PoE POWERED DEVICE CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.8895 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    240 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.899 mm

LTC4267CGN-1#PBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output capacitors close to the IC, and use short, wide traces for the high-current paths. Avoid routing high-frequency signals near the IC's sensitive analog nodes.
  • Monitor the IC's junction temperature (TJ) and ensure it stays below the maximum rating of 150°C. Calculate the IC's power dissipation (PD) and ensure it stays within the SOA curve. Use a thermal interface material (TIM) and a heat sink if necessary.
  • Not using the recommended capacitors can lead to reduced performance, increased noise, and potential instability. The capacitors help filter out noise, reduce ripple, and ensure proper voltage regulation. Using incorrect or low-quality capacitors can compromise the IC's performance and reliability.
  • Use an oscilloscope to monitor the input and output voltages, as well as the IC's internal signals. Check for proper PCB layout, component selection, and soldering. Verify the input voltage, output load, and ambient temperature are within the recommended specifications. Consult the datasheet and application notes for troubleshooting guides.
  • Yes, but ensure the IC is operated within its specified temperature range (-40°C to 125°C) and follow the recommended derating guidelines for high-temperature operation. Consult the datasheet and application notes for specific guidance on high-reliability and high-temperature applications.

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LTC4267CGN-1#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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