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LTC4332CUFD#PBF - Analog Devices

Description: SPI EXTEND OVER RUGGED DIFFERENT

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LTC4332CUFD#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTC4332CUFD#PBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UFD - 20-Lead Plastic QFN (4mm x 5mm)
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3D Models
LTC4332CUFD#PBF - Analog Devices - 3D model - Quad Flat No-Lead - UFD - 20-Lead Plastic QFN (4mm x 5mm)
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LTC4332CUFD#PBF Details

  • Manufacturer Part Number:

    LTC4332CUFD#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    05-08-1711

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2019-10-24

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    SEATED HT-CALCULATED

  • Interface IC Type:

    INTERFACE CIRCUIT

  • Interface Standard:

    SPI

  • JESD-30 Code:

    R-PQCC-N20

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.16X.2,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

LTC4332CUFD#PBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize noise and coupling.
  • Follow the recommended power-up sequence: VCC, then VDD, then EN. Ensure all input and output pins are properly terminated and configured according to the datasheet.
  • The device has a thermal pad on the bottom. Ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Keep the device away from heat sources and ensure good airflow.
  • Use a logic analyzer or oscilloscope to monitor the input and output signals. Check the power supply and configuration pins for proper voltage and configuration. Consult the datasheet and application notes for troubleshooting guides.
  • Yes, follow proper EMI/EMC design practices: use a shielded enclosure, keep cables and wires short, and use EMI filters or shielding on I/O lines. Ensure the device is properly grounded and decoupled.

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LTC4332CUFD#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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