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LTC6081HMS8#TRPBF - Analog Devices

Description: Precision Amplifiers Dual 300uA CMOS Op Amp

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LTC6081HMS8#TRPBF Details

  • Manufacturer Part Number:

    LTC6081HMS8#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1660

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0005 µA

  • Common-mode Reject Ratio-Min:

    86 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    90 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    0.87 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3600

  • Voltage Gain-Min:

    1000000

  • Wideband:

    YES

  • Width:

    3 mm

LTC6081HMS8#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC6081 involves keeping the input and output traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the output capacitor is properly sized and placed close to the device. A minimum output capacitance of 10uF is recommended.
  • The LTC6081 is rated for operation from -40°C to 125°C. However, the device's performance may degrade at extreme temperatures. It's essential to ensure proper thermal management and heat sinking to maintain optimal performance.
  • Yes, the LTC6081 is suitable for high-reliability and aerospace applications. However, it's essential to follow the recommended design and manufacturing guidelines to ensure the device meets the required standards and specifications.
  • To troubleshoot issues with the LTC6081, start by verifying the input voltage, output voltage, and current. Check the PCB layout and component values to ensure they match the recommended values. Use an oscilloscope to inspect the output waveform and identify any signs of oscillation or instability.

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LTC6081HMS8#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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