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LTC6261HS6#TRMPBF - Analog Devices

Description: Gain Bandwidth Product: 30MHz n Low Quiescent Current: 240µA n Op Amp Drives up to 1nF Capacitive Loads n Offset Voltage: 400µV Maximum n Rail-to-Rail Input and Output n Supply Voltage Range: 1.8V to 5.25V n Input Bias Current: 100nA Maximum n CMRR/PSRR: 100dB/95dB n Shutdown Current: 10µA Maximum n Operating Temperature Range: –40°C to 125°C n Single in 6-Lead TSOT-23, 2mm × 2mm DFN Packages n Dual in 8-Lead MS8, MS10, TS0T-23, 2mm × 2mm DFN Packages n Quad in MS16 Package

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LTC6261HS6#TRMPBF - Analog Devices - PCB symbol
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PCB Footprints
LTC6261HS6#TRMPBF - Analog Devices PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - S6 Package 6-Lead Plastic TSOT-23 (Reference LTC DWG # 05-08-1636)
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3D Models
LTC6261HS6#TRMPBF - Analog Devices - 3D model - SOT23 (6-Pin) - S6 Package 6-Lead Plastic TSOT-23 (Reference LTC DWG # 05-08-1636)
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LTC6261HS6#TRMPBF Details

  • Manufacturer Part Number:

    LTC6261HS6#TRMPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOT-23, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    05-08-1636

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.15 µA

  • Bias Current-Max (IIB) @25C:

    0.05 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1000 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1 mm

  • Slew Rate-Nom:

    6.5 V/us

  • Supply Current-Max:

    0.3 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    28000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    1.625 mm

LTC6261HS6#TRMPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC6261HS6#TRMPBF involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the input and output capacitors. A 4-layer PCB with a dedicated ground plane is recommended. Additionally, it's essential to follow the layout guidelines provided in the datasheet and application notes.
  • The choice of input and output capacitors depends on the specific application requirements. For the LTC6261HS6#TRMPBF, a low-ESR ceramic capacitor (e.g., X5R or X7R) with a value between 1uF to 10uF is recommended for the input capacitor. For the output capacitor, a low-ESR ceramic or film capacitor with a value between 1uF to 22uF is suitable. The capacitor selection should also consider the operating frequency, voltage rating, and temperature range.
  • The LTC6261HS6#TRMPBF has an operating temperature range of -40°C to 125°C. However, the device's performance and reliability may degrade at extreme temperatures. It's essential to ensure that the device operates within the recommended temperature range for optimal performance and reliability.
  • To minimize EMI and RFI in your design, use proper shielding, grounding, and layout techniques. Keep the device and its associated components away from noise sources, and use a metal shield or a shielded enclosure to contain the noise. Additionally, use a common-mode choke or a ferrite bead to filter out high-frequency noise on the input and output lines.
  • The recommended power-up sequence for the LTC6261HS6#TRMPBF is to apply the power supply voltage (VCC) before applying the input signal. This ensures that the device is properly biased and configured before the input signal is applied. A slow power-up ramp (e.g., 1ms to 10ms) is also recommended to prevent voltage overshoots and ensure reliable operation.

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LTC6261HS6#TRMPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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