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LTC6263IMS#PBF - Analog Devices

Description: Quad 30MHz, 240μA Power Efficient Rail-to-Rail I/O Op Amps

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LTC6263IMS#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTC6263IMS#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS Package 16-Lead Plastic MSOP_2025
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3D Models
LTC6263IMS#PBF - Analog Devices - 3D model - Small Outline Packages - MS Package 16-Lead Plastic MSOP_2025
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LTC6263IMS#PBF Details

  • Manufacturer Part Number:

    LTC6263IMS#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    MSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1669

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.15 µA

  • Bias Current-Max (IIB) @25C:

    0.05 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1000 µV

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.039 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    6.5 V/us

  • Supply Current-Max:

    0.3 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    28000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3 mm

LTC6263IMS#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC6263 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended. Additionally, the datasheet provides a recommended PCB layout and land pattern that should be followed.
  • To ensure stability, it's essential to follow the recommended compensation network and component values provided in the datasheet. Additionally, the input and output capacitors should be selected based on the specific application requirements, and the device should be operated within its recommended operating conditions. It's also important to minimize parasitic inductance and capacitance in the layout.
  • The maximum power dissipation of the LTC6263 is dependent on the package type and the ambient temperature. For the MSOP package, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this value can be derated based on the ambient temperature and the thermal resistance of the package. The datasheet provides a thermal derating curve that should be consulted.
  • The LTC6263 is rated for operation from -40°C to 125°C. However, the device's performance and reliability may be affected at high temperatures. It's essential to consult the datasheet and evaluate the device's performance in the specific application environment. Additionally, the device's power dissipation should be carefully managed to prevent overheating.
  • The input and output capacitors should be selected based on the specific application requirements, including the operating frequency, input voltage, and output current. The datasheet provides guidelines for selecting the input and output capacitors, including the recommended capacitor values and types. Additionally, the capacitors should be placed close to the device and have low equivalent series resistance (ESR) and high ripple current capability.

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LTC6263IMS#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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