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LTC6655BHMS8-5#PBF - Analog Devices

Description: Voltage References Ultra Low Noise, 5V Precision Voltage Reference

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PCB Footprints
LTC6655BHMS8-5#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8 Package 8-Lead Plastic MSOP (Reference LTC DWG # 05-08-1660 Rev F)
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3D Models
LTC6655BHMS8-5#PBF - Analog Devices  - 3D model - Small Outline Packages - MS8 Package 8-Lead Plastic MSOP (Reference LTC DWG # 05-08-1660 Rev F)
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LTC6655BHMS8-5#PBF Details

  • Manufacturer Part Number:

    LTC6655BHMS8-5#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1660

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    5.0012 V

  • Output Voltage-Min:

    4.9987 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    7.5 mA

  • Supply Voltage-Max (Vsup):

    13.2 V

  • Supply Voltage-Min (Vsup):

    5.198 V

  • Supply Voltage-Nom (Vsup):

    5.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temp Coef of Voltage-Max:

    2 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Voltage Tolerance-Max:

    0.025%

  • Width:

    3 mm

LTC6655BHMS8-5#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC6655BHMS8-5#PBF involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper bypassing, place a 10uF ceramic capacitor between the VCC pin and the GND pin, and a 100nF ceramic capacitor between the AVCC pin and the GND pin. Additionally, use a 1uF ceramic capacitor between the VREF pin and the GND pin.
  • The recommended input voltage range for the LTC6655BHMS8-5#PBF is 4.5V to 5.5V. Operating the device outside of this range may affect its performance and accuracy.
  • Calibration of the LTC6655BHMS8-5#PBF involves trimming the internal voltage reference using the TRIM pin. A calibration procedure is typically performed at the factory, but it can also be done in-system using a calibration routine. Consult the datasheet for more information.
  • The thermal resistance of the LTC6655BHMS8-5#PBF package is typically around 30°C/W. This value can vary depending on the specific application and PCB design.

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LTC6655BHMS8-5#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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