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LTC6752ISC6-4#TRMPBF - Analog Devices

Description: Analog Comparators 280MHz CMOS Comparator with Output Supply

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LTC6752ISC6-4#TRMPBF - Analog Devices - PCB symbol
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PCB Footprints
LTC6752ISC6-4#TRMPBF - Analog Devices PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC6 6 Lead Plastic SC70
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3D Models
LTC6752ISC6-4#TRMPBF - Analog Devices - 3D model - SOT23 (6-Pin) - SC6 6 Lead Plastic SC70
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LTC6752ISC6-4#TRMPBF Details

  • Manufacturer Part Number:

    LTC6752ISC6-4#TRMPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-70, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    05-08-1638

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    2.1 µA

  • Bias Current-Max (IIB) @25C:

    1.25 µA

  • Input Offset Voltage-Max:

    8500 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Response Time-Nom:

    2.9 ns

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    2.5 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    1.25 mm

LTC6752ISC6-4#TRMPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC6752 involves keeping the input and output traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, ensure that the output capacitor is within the recommended range, the input voltage is within the specified range, and the device is operated within the recommended temperature range. Additionally, a minimum of 10nF capacitor is recommended between the VIN and GND pins.
  • The maximum power dissipation of the LTC6752 is dependent on the ambient temperature and the thermal resistance of the package. For the ISC6 package, the maximum power dissipation is approximately 1.4W at 25°C ambient temperature.
  • The LTC6752 is rated for operation up to 125°C, but the maximum junction temperature is 150°C. However, the device's performance and reliability may degrade at high temperatures. It is recommended to derate the device's power dissipation and ensure proper thermal management in high-temperature environments.
  • To troubleshoot issues with the LTC6752, start by verifying the input voltage, output voltage, and current consumption. Check for proper PCB layout, decoupling, and thermal management. Use an oscilloscope to check for oscillations or noise on the output. Consult the datasheet and application notes for guidance on troubleshooting common issues.

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LTC6752ISC6-4#TRMPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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