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LTC6902IMS#PBF - Analog Devices

Description: LTC6902IMS#PBF, Silicon Oscillator, 20MHz, 10-Pin MSOP

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LTC6902IMS#PBF - Analog Devices - PCB symbol
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LTC6902IMS#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS Package-ren1
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LTC6902IMS#PBF - Analog Devices - 3D model - Small Outline Packages - MS Package-ren1
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LTC6902IMS#PBF Details

  • Manufacturer Part Number:

    LTC6902IMS#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    05-08-1661

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    PLL FREQUENCY SYNTHESIZER

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC6902IMS#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC6902IMS#PBF involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a low-ESR capacitor for the VCC bypass capacitor.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the output capacitor is properly sized and that the device is operated within its recommended operating conditions.
  • The maximum power dissipation of the LTC6902IMS#PBF is dependent on the package type and thermal resistance. For the IMS#PBF package, the maximum power dissipation is approximately 1.4W. To calculate the power dissipation, use the formula: Pd = (VIN - VOUT) x IOUT.
  • The LTC6902IMS#PBF is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the device's power dissipation and ensure proper thermal management to ensure reliable operation.
  • To troubleshoot issues with the LTC6902IMS#PBF, start by verifying the PCB layout and component values. Check for proper power supply decoupling, output capacitor sizing, and input voltage regulation. Use an oscilloscope to measure the output voltage and current, and check for signs of oscillation or instability.

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LTC6902IMS#PBF Overview

Use the download button to access the LTC6902IMS#PBF schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LTC69, or try a keyword search, such as PLL or Frequency Synthesis Circuits

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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