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LTC6957HMS-3#PBF - Analog Devices

Description: Low Phase Noise Buffer/Driver

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LTC6957HMS-3#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS Package 12-Lead Plastic MSOP
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LTC6957HMS-3#PBF - Analog Devices  - 3D model - Small Outline Packages - MS Package 12-Lead Plastic MSOP
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LTC6957HMS-3#PBF Details

  • Manufacturer Part Number:

    LTC6957HMS-3#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    MSOP-12

  • Pin Count:

    12

  • Manufacturer Package Code:

    05-08-1668

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Family:

    6957

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    R-PDSO-G12

  • JESD-609 Code:

    e3

  • Length:

    4.039 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP12,.19

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Power Supply Current-Max (ICC):

    27.5 mA

  • Prop. Delay@Nom-Sup:

    4.8 ns

  • Propagation Delay (tpd):

    4.8 ns

  • Same Edge Skew-Max (tskwd):

    0.035 ns

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

LTC6957HMS-3#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC6957HMS-3#PBF involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source, and decouple it with a 0.1uF capacitor to ground. The VEE pin should be connected to a stable negative voltage source or ground, depending on the application. The bias voltage should be within the recommended range of 2.7V to 5.5V.
  • The maximum power dissipation of the LTC6957HMS-3#PBF is 1.4W. However, this can be affected by the operating frequency, supply voltage, and ambient temperature. It's essential to ensure the device is properly heat-sinked and operated within the recommended specifications to prevent overheating.
  • The LTC6957HMS-3#PBF is rated for operation from -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to ensure the device is properly heat-sinked and operated within the recommended specifications to prevent overheating and ensure reliable operation.
  • Common issues with the LTC6957HMS-3#PBF include oscillations, instability, and incorrect output voltage. To troubleshoot, check the PCB layout, decoupling, and biasing. Ensure the device is properly terminated, and the input and output traces are short and well-separated. Consult the datasheet and application notes for more information.

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LTC6957HMS-3#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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