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LTC7060IMSE#WPBF - Analog Devices

Description: 100V Half-Bridge Driver with Floating Grounds and Adjustable Dead-Time

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LTC7060IMSE#WPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSE Package 12-Lead Plastic MSOP Exposed Die Pad
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LTC7060IMSE#WPBF Details

  • Manufacturer Part Number:

    LTC7060IMSE#WPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSSOP-12

  • Pin Count:

    12

  • Manufacturer Package Code:

    05-08-1666

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2020-04-17

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G12

  • Length:

    4.039 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Peak Current Limit-Nom:

    6 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP12,.19

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    14 V

  • Supply Voltage-Min:

    6 V

  • Supply Voltage-Nom:

    10 V

  • Supply Voltage1-Max:

    100 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.036 µs

  • Turn-on Time:

    0.03 µs

  • Width:

    3 mm

LTC7060IMSE#WPBF Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for the LTC7060's performance. Analog Devices recommends a 4-layer board with a solid ground plane, and to keep the input and output traces short and wide. Additionally, it's recommended to place the input and output capacitors close to the IC and to use a common ground point for the input and output returns.
  • The choice of input and output capacitors depends on the specific application requirements. For the LTC7060, a low-ESR ceramic capacitor (e.g. X5R or X7R) with a value of 10uF to 22uF is recommended for the input capacitor, and a low-ESR ceramic or film capacitor with a value of 10uF to 47uF is recommended for the output capacitor.
  • The LTC7060 is rated for operation up to 125°C ambient temperature, but it's recommended to derate the output current and voltage at higher temperatures to ensure reliable operation. Consult the datasheet for more information on thermal derating.
  • To ensure EMC compliance, it's recommended to follow good PCB layout practices, such as keeping the input and output traces short and away from each other, using a common ground point, and adding EMI filters or shielding if necessary. Additionally, the LTC7060 has built-in EMI filtering, but it's still important to follow proper layout and design practices.
  • The recommended input voltage range for the LTC7060 is 2.7V to 5.5V, but it can operate down to 2.5V with reduced performance. It's recommended to operate the device within the recommended input voltage range for optimal performance and reliability.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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