Bivar recommends a PCB layout with a solid ground plane and thermal vias under the device to ensure efficient heat dissipation. A minimum of 2 oz copper thickness is recommended.
Bivar recommends using a soldering temperature of 250°C (max) and a soldering time of 3 seconds (max) to prevent damage to the device. A soldering iron with a temperature control is recommended.
The maximum allowable voltage drop across the LTM-270 is 2.5V. Exceeding this voltage drop may lead to reduced performance and reliability.
The LTM-270 is not designed for use in high-humidity environments. If operation in humid environments is required, consider using a conformal coating or potting the device to prevent moisture ingress.
Bivar recommends storing the LTM-270 in a dry, cool place with a temperature range of -20°C to 40°C and a relative humidity of 60% or less.
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LTM-270 Overview
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