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LTM2883CY-3I#PBF - Analog Devices

Description: DGTL ISO 2.5KV 6CH I2C 32BGA

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LTM2883CY-3I#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTM2883CY-3I#PBF - Analog Devices PCB footprint - BGA - BGA - 32-Lead (15mm x 11.25mm x 3.42mm)
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LTM2883CY-3I#PBF - Analog Devices - 3D model - BGA - 32-Lead (15mm x 11.25mm x 3.42mm)
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LTM2883CY-3I#PBF Details

  • Manufacturer Part Number:

    LTM2883CY-3I#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    05-08-1851

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PBGA-B32

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA32,8X11,50

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    3.62 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.62 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    HYBRID

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11.25 mm

LTM2883CY-3I#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTM2883CY-3I involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals to minimize noise and interference.
  • To ensure proper powering and decoupling of the LTM2883CY-3I, use a high-quality power supply with low noise and ripple, and add decoupling capacitors (e.g., 10uF and 100nF) close to the device's power pins. Additionally, use a 1uF capacitor between the VCC and GND pins to filter out high-frequency noise.
  • The maximum cable length supported by the LTM2883CY-3I depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths up to 10 meters for RS-232 and 100 meters for RS-485, assuming a good quality cable with proper shielding and termination.
  • To troubleshoot common issues with the LTM2883CY-3I, start by checking the power supply and decoupling, ensuring that the device is properly powered and decoupled. Next, verify the signal integrity and quality using an oscilloscope or logic analyzer. Check for proper termination and shielding of the cables, and ensure that the device is configured correctly for the specific application.
  • Yes, when designing with the LTM2883CY-3I, it's essential to take into account EMI/EMC considerations to ensure reliable operation and compliance with regulatory standards. This includes using proper shielding and grounding, keeping sensitive analog signals away from digital signals, and using EMI filters or common-mode chokes to reduce emissions and susceptibility.

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LTM2883CY-3I#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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