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LTM2883CY-3S#PBF - Analog Devices

Description: Digital Isolators SPI uModule Isolator with Adjustable +/-12.5V and 5V Regulated Power

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LTM2883CY-3S#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTM2883CY-3S#PBF - Analog Devices PCB footprint - BGA - BGA - 32-Lead (15mm × 11.25mm × 3.42mm)_
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LTM2883CY-3S#PBF - Analog Devices - 3D model - BGA - 32-Lead (15mm × 11.25mm × 3.42mm)_
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LTM2883CY-3S#PBF Details

  • Manufacturer Part Number:

    LTM2883CY-3S#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    05-08-1851

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PBGA-B32

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA32,8X11,50

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Seated Height-Max:

    3.62 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.62 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    1.62 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    HYBRID

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Width:

    11.25 mm

LTM2883CY-3S#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTM2883CY-3S involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the IC and the power supply. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper powering and decoupling, use a high-quality, low-ESR capacitor (e.g., 10uF ceramic) between the VIN pin and GND, and a 0.1uF ceramic capacitor between the VCC pin and GND. Additionally, use a 1uF capacitor between the VOUT pin and GND for output decoupling.
  • The LTM2883CY-3S supports cable lengths up to 10 meters (33 feet) for USB 2.0 and up to 3 meters (10 feet) for USB 3.0, assuming a good quality cable with proper shielding and termination.
  • To configure the LTM2883CY-3S for USB 3.0 operation, connect the USB3_EN pin to a logic high (VCC) and ensure the USB 3.0 signal lines are properly terminated with 45Ω resistors to VCC and GND.
  • To manage thermal dissipation, use a thermal pad or a heat sink with a thermal conductivity of at least 1 W/m-K, and ensure good airflow around the IC. The maximum junction temperature (TJ) should not exceed 125°C.

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LTM2883CY-3S#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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