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LTM2887IY-3S#PBF - Analog Devices

Description: SPI/Digital or I2C ??Module Isolator with Dual Adjustable 5V Regulators

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LTM2887IY-3S#PBF - Analog Devices PCB footprint - BGA - BGA - 32-Lead (15mm x 11.25mm x 3.42mm)
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LTM2887IY-3S#PBF - Analog Devices  - 3D model - BGA - 32-Lead (15mm x 11.25mm x 3.42mm)
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LTM2887IY-3S#PBF Details

  • Manufacturer Part Number:

    LTM2887IY-3S#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    05-08-1851

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-XBGA-B32

  • Length:

    11.25 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA32,8X11,50

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    3.62 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    HYBRID

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

LTM2887IY-3S#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTM2887IY-3S involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals to reduce noise and interference.
  • To ensure the reliability of the LTM2887IY-3S in high-temperature applications, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive material for the PCB, and ensuring good airflow around the device. Additionally, it's recommended to derate the device's power dissipation according to the ambient temperature.
  • A recommended input filter configuration for the LTM2887IY-3S involves using a combination of ceramic capacitors and ferrite beads to filter out high-frequency noise and ripple. A 10uF ceramic capacitor in parallel with a 100nF ceramic capacitor, followed by a ferrite bead, can provide effective noise filtering.
  • To troubleshoot common issues with the LTM2887IY-3S, it's recommended to follow a systematic approach, starting with checking the power supply and input voltage, then verifying the device's configuration and communication settings. Use oscilloscopes and logic analyzers to debug the issue, and consult the device's datasheet and application notes for guidance.
  • When using the LTM2887IY-3S in a system with multiple power domains, it's essential to ensure that the device is properly isolated from the other power domains to prevent noise and interference. Use isolation techniques such as optocouplers or digital isolators to separate the power domains, and follow proper PCB layout practices to minimize crosstalk.

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LTM2887IY-3S#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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