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LTM2889IY-3#PBF - Analog Devices

Description: LINEAR TECHNOLOGY - LTM2889IY-3#PBF - CAN Bus, CAN, 3 V, 3.6 V, BGA

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LTM2889IY-3#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTM2889IY-3#PBF - Analog Devices PCB footprint - BGA - BGA - 32-Lead (15mm x 11.25mm x 3.42mm)
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LTM2889IY-3#PBF - Analog Devices - 3D model - BGA - 32-Lead (15mm x 11.25mm x 3.42mm)
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LTM2889IY-3#PBF Details

  • Manufacturer Part Number:

    LTM2889IY-3#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    05-08-1851

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Data Rate:

    4000 Mbps

  • JESD-30 Code:

    R-PBGA-B32

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    3.62 mm

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    HYBRID

  • Telecom IC Type:

    CAN FD TRANSCEIVER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11.25 mm

LTM2889IY-3#PBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use short, wide traces for power and ground connections.
  • Use a high-quality, low-ESR capacitor (e.g., 10uF ceramic) as close to the device as possible. Add a 1uF ceramic capacitor in parallel for additional decoupling. Ensure the power supply is clean and well-regulated.
  • Use a pi-filter (R-C-R) or a T-filter (L-C-R) configuration to filter out high-frequency noise and ensure a clean input signal. The filter components should be chosen based on the specific application and noise environment.
  • Use a low-noise, low-impedance power supply. Ensure the input signal is clean and well-filtered. Use a high-quality, low-noise reference voltage source. Optimize the layout to minimize noise coupling and ensure good thermal management.
  • Use a heat sink or a thermal pad to dissipate heat. Ensure good airflow around the device. Avoid thermal gradients and hot spots. Use thermal interface materials (e.g., thermal tape or thermal grease) to improve heat transfer.

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LTM2889IY-3#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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